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Welcome to our company presentation!

2013-05-24:

All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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AUTOMATED CHUCKING SYSTEMS

Automated chucking system for use in three different ways:

  • individual chucking module CM 3000,
    integrable into other existing systems, e.g. process tools
  • fully automated chucking unit ACU 3000
  • stand-alone chucking unit SCU 3000

Technical Features

  • Non-contact substrate/wafer handling as per
    Bernoulli’s principle with high precision alignment
  • Throughput of up to 120 carrier packages per hour

Process Media

Power supply 100–240 V
Pneumatics N₂ or CDA
Vacuum  

Clean Room Class

100, 10

Communication

SEMI Standard SECS/GEM

Applications

Silicon wafers in size 6", 8", and 12" as well as other substrates