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Welcome to our company presentation!

2013-05-24:

All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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BACK SIDE GAS COOLING HT T-ESC®

(MEMBER OF THE HT T-ESC® FAMILY)

Optimized for processing of clamped thin wafers during exothermal processes with controlled temperature development due to active and direct Back Side Gas Cooling (He/Ar) of the thin wafer device.

The same applications supported through the standard HT Carrier are likewise supported by the BSGC HT T-ESC®.

Typical Applications

  • Metal deposition (Cu/Ta, etc.)
  • Dry etching (DRIE/RIE)
  • High dosis/energy implant

Qualified Equipment

  • AMAT Endura
  • STS Pegasus