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Welcome to our company presentation!


All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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Membership German Flat Display Forum (DFF)


ProTec Carrier Systems GmbH became a member of German Flat Panel Display Forum (DFF). Our intention therefore is to meet new customers, to understand market dynamics of the flat panel display industry as well as to provide an enlargement of our application portfolio in the field of display technology.

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PCS exhibits on Intersolar Europe 2012 in Munich June 13-15, 2012


We are very excited to announce that ProTec Carrier Systems can be visited in Munich on June 13-15, 2012. We give you insight into our latest technology projects with new aspects and focus on applications in PV industry and related tool manufacturers.

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Business Areas

Electrostatic Chuck Systems

ProTec's Electrostatic Chuck Systems offer an unique technique to clamp substrates safely. Based on Coulomb´s law the electrostatic chuck generates a homogeneous clamping force between substrate and chuck. The clamping process is reversible and ensures a quick substrate release. Furthermore, ProTec’s Electrostatic Chuck Systems can handle even large and thin substrates under rough conditions safely. Due to our expertise in stationary and transferable chucking systems we are able to provide fully integrated solutions for new and already existing equipment, starting from the prototype phase to full-scale production. Great emphasis is placed on the right combination of Electrostatic Chuck and Measurement Controller (high-voltage supply) merged into Electrostatic Chuck Systems.


ProTec’s Transfer Electrostatic Carrier (T-ESC®) Technology provides safe and easy handling of thin materials. T-ESC® Technology is based on using an electrical field to apply an electrostatic force (Coulomb force) on materials of rather low conductivity. The mobile electrostatic carriers (T-ESC®) developed by PCS establish such a field and chuck especially thin and ultra-thin (< 50µm) substrates over a long period of time (up to 50 hours). The quick release at the end of the process leaves absolutely no contaminants on the substrate. Organic residues caused by the use of tape or by bonding – therefore requiring additional cleaning processes – are thus avoided. All existing standard tools, equipment, and processes remain fully utilizable.

Warping and bowing of thin materials are avoided during the entire process thanks to carrier protection. PCS offers a great variety of carriers suitable for many processes in the semiconductor and photovoltaic manufacturing industry.

Chucking Systems

ProTec Carrier Systems GmbH offers manual as well as automated solutions to facilitate Transfer Electrostatic Carrier (T-ESC®) usage for handling and processing thin and ultra-thin (<50µm) substrates, specifically wafers. Besides ProTec’s well-established manual chucking unit MCU 3000 for the chucking/de-chucking of wafers onto carriers, a newly developed automated chucking system is now available. It can be implemented in three different ways:

  • as a fully Automated Chucking Unit ACU 3000 with sorter/handler function
  • as a Stand-alone Chucking Unit SCU 3000 with semi-automated handling
  • as an individual Chucking Module CM 3000, integrable into other existing systems, e.g. process or handling tools

The manual handling process can be protected by a wide range of ProTec Rackets. A Racket combines the functionality of a mobile electrostatic carrier (T-ESC®) with a mobile handheld charging unit integrated into a handling grip. One-hand operated, the Racket is capable of transporting thin substrates through temporary clamping without damaging the edge or surface.