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Welcome to our company presentation!

2013-05-24:

All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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Electrostatic Chuck

  • uses electrostatic field to clamp various substrates
  • enables secure holding of substrates especially during high-temperature, coating and plasma processes also in vacuum environment
  • performs electrostatic fixing of thin foils
  • enables cooling during high-temperature processes, especially in vacuum
  • improves processing results replacing mechanical and vacuum clamping
  • helps to avoid partial occlusion, eliminates bow and warp
  • enables easy reversible clamping
  • enables processing upside-down
  • reduces scrap rate by edge protection, no breakage
  • clamps several substrates on single e-chuck
  • manufactured in customized sizes, shapes and of numerous materials