Latest News

ProTec offers the solution for mass production of MicroLEDs


Actually the huge benefits of MicroLEDs cannot be used, due to the missing mass production readiness of the transfer process. Currently one of the established methods is to transfer the MicroLED from its donor wafer to the target substrate by electrostatic force.

ProTec, the worldwide leader in mobile transfer solutions,

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SID Display Week 2016 in San Francisco


Visit our booth at the German Pavilion at this year's SID Display Week in San Francisco from May 22th to May 27 th 2016. Get in touch with our latest developments in the field of handling and processing glass and foil based substrates in various processes such as OLED coating, optical bonding and plasma based high temperature coating.

Mobile T-ESC in Inline Glass Coating application


Advanced process steps and materials require additional glass support in order to work reliable. The mobile T-ESC Technology is perfectly suited to accomplish this support in an economical and ease to use way. The glass substrate can be fixed just within 3 seconds, no particles are generated on the critical surface and the glass is relieved from rigid mobile T-ESC in 3 seconds again.

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Welcome to ProTec Carrier Systems GmbH

ProTec Carrier Systems offers solutions for processing and handling of thin and ultra-thin (<50 µm) substrates based on its proprietary Transfer ElectroStatic Carrier (T-ESC®) technology as well as stationary ESC technology.