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Welcome to our company presentation!


All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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General Information

  • Vacuum must be switched on for clamping a
    substrate/wafer and switched off for releasing it
  • De-chucking can also be performed by backside purge
  • During handling, substrates/wafers are protected
    through the whole racket surface area
  • Flat/Notch marker supports manual pre-alignment

Technical Data

Process Media

Compressed air


4”, 6”, 8”, 12”, customized solutions,
e.g. square-shaped solar cells
156 x 156 mm


  • Standard unipolar racket for handling thin and ultra-thin substrates/wafers and for charging a unipolar T-ESC®
  • Essential for charging a unipolar carrier (T-ESC®) at the Manual Chucking Unit MCU 3000


  • Capable of clamping a Taico-shaped substrate/wafer by means of vacuum and transporting or transferring it onto a unipolar carrier (T-ESC®)
  • Contacts a Taico substrate/wafer during chucking onto a unipolar carrier by touching the cavity in the whole Taico substrate/wafer area

Additional Information

The design facilitates good contact to the Taico wafer bottom and provides excellent protection for the whole Taico substrate/wafer surface during handling.


Design 1
Design 2

Two designs are available

Design 1: Edge Racket with needles

Contacting tool with minimum contact area. During chucking/de-chucking, the substrate/wafer is touched at the edge by 4 contact needles only.

Additional Information

This design is useful when the substrate has a non-conductive coating, e.g. photoresist. Only 4 small openings are needed to achieve unipolar contact.

Design 2
: Edge Racket with annulus

Handling and contacting tool with minimum contact area that contacts the substrate/wafer only in the standard edge area (~4,0 mm).


Special unipolar racket, similar to the Edge Racket with annulus, conceived to handle a substrate/wafer of smaller size in combination with a unipolar carrier of larger size, e.g. wafer 6” on carrier 8” (adapter function).

Additional Information

Purpose is to process smaller wafers in systems or tools of larger size (bridging tool). In order to center the smaller substrate in the carrier, the Adapter Side Table is essential.

Technical Data

Sizes: 4“ to 6“, 6” to 8”, 8” to 12”, customized solutions