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Welcome to our company presentation!


All those interested to get to know more about our company are warmly invited to our company presentation on the 44th Plenary Meeting of the German Flat Panel Display Forum (DFF) “Application and System Integration, value-added design” hosted by EuropTec GmbH in Goslar on 6th June 2013.

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T-ESC® Technology offers safe and easy handling as well as processing of thin and ultra-thin substrates. The basic concept behind this reversible chucking technology involves using electrostatic force to clamp thin and ultra-thin flexible wafers onto robust carriers (T-ESC®). Such wafer-carrier packages can be handled and processed like wafers of standard thickness. Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Warp and bow of thin and ultra-thin substrates are eliminated.

PCS offers different types of carriers (T-ESC®) applicable to a great variety of process applications.

Technical Data:

  • All carriers are available in sizes 4”, 6”, 8”, and 12” according to the SEMI standards
  • Moreover, non-standard sizes, substrates for photovoltaic purposes, or display applications can be customized