The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates (thinner 50 µm), e.g. GaAs, InP, LN, LT, thin silicon, thin MEMS wafer and many more. The basic concept behind this adhesive free temporary bonding technology involves using electrostatic force to chuck thin and ultra-thin wafers onto mobile rigid Carriers (T-ESC®). Such wafer-Carrier packages can be handled and processed like wafers of standard thickness.

Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Additional effect: the warping and bowing of thin and ultra-thin substrates are eliminated, which is highly welcome. All our Carriers are available in standard sizes from 2" to 12" and additionally in customized shapes suited to the intended application.



The Standard High-Temperature Transfer ElectroStatic Carrier (HT T-ESC®) is an adapted solution for thin wafer handling support during processes involving high temperature impact (up to 400 °C) and vacuum.

back to the overview


Typical Applications

  • Thin wafer handling support during processes involving high temperature impact (up to 400 °C), vacuum suited

  • Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors, etc.)

  • Ultra Low contamination

  • High flatness

  • Outgassing free

  • Reusable

  • Sizes from 2" to 12", customized shapes and features possible

SEMI conform package after chucking mounted wafer ready for application

  • Thickness of package ~750 μm

  • Package can be handled and processed by standard equipment

Recommended Processes

  • Electroplating

  • Annealing

  • DIE Handling

  • Handling


Standard High-Temperature Transfer ElectroStatic Carrier Technology


During Wafer processing the wafer needs to be transferred back and forth from cassettes to tools and also inside the tools from on station to the other. For fragile substrates this is already challenging, because they tend do brake or get cracks, which can lead to future breakage.  Also bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling, therefore wafer breakage is eliminated.

Electro Plating

Electro Plating is a method to form layers out of a liquid phase onto a substrate. The desired regions are masked and the substrate is dipped into the bath, usually the backside is covered and by applying an electrical field between the substrate and the liquid a layer forms on the not covered surface of the substrate.


Substrate is heated up to a specific temperature, e.g. after ion implantation to heal the damage from the process.

DIE Handling

Multiple substrate operation is often required when already diced DIEs need further processing in an economical way. Multiple of them can be temporary bonded to our mobile electrostatic Carrier (T-ESC®) and processed as a standard wafer size, after that they can be transferred to the final substrate and bonded with releasing the T-ESC® afterwards.

Our Machines

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

Learn More
MCU 3000 freigestellt

MCU 3000

A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.

Learn More