During Wafer processing the wafer needs to be transferred back and forth from cassettes to tools and also inside the tools from on station to the other. For fragile substrates this is already challenging, because they tend do brake or get cracks, which can lead to future breakage.  Also bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling, therefore wafer breakage is eliminated.

Electro Plating is a method to form layers out of a liquid phase onto a substrate. The desired regions are masked and the substrate is dipped into the bath, usually the backside is covered and by applying an electrical field between the substrate and the liquid a layer forms on the not covered surface of the substrate.

Substrate is heated up to a specific temperature, e.g. after ion implantation to heal the damage from the process.

Multiple substrate operation is often required when already diced DIEs need further processing in an economical way. Multiple of them can be temporary bonded to our mobile electrostatic Carrier (T-ESC®) and processed as a standard wafer size, after that they can be transferred to the final substrate and bonded with releasing the T-ESC® afterwards.