Handling

Spin Etching

Probing

(Single Wafer) Spin Etching

Handling

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

Slide-Off De-Bonding

Handling

Electro Plating

Annealing

DIE Handling

Three Basic Sizes:

3"/4”/6”, 6”/8”, 8”/12” and

customized versions on request

Weight:

20 kg

Process Media:

Power supply
N2 (CDA/compressed air),
Vacuum

Machine Dimensions:

L x W x H:
621 x 430 x 330 mm

Selectable Chucking Voltage:

0 to 3kV

Weight:

1000 kg

Process Media:

Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum

Communication:

SEMI Standard SECS/GEM
others on request

Machine Dimensions:

L x W x H: 1440 x 1485 x 2092 mm

Weight:

1000 kg

Clean Room Class: 100, 10

Electro Plating

Handling

Ion Implantation

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Optical Bonding

Handling

Substrate Bending

Handling

PVD/Sputter

CVD

Plasma Cleaning / Ashing

Ion Beam Etching/ Trimming

Ion Implantation

Optional Media:

N2 or CDA, Vacuum

Process Media:

Power supply 9V battery

Sizes:

4”, 6”, 8”, 12”, other shapes on request

H³ Electrostatic Chuck Power Supply:

Output voltage range: 0 to ± 3 kV (6kV)

Output voltage accuracy: <1 %

Output current: <1 mA

Output current accuracy: <1% with a resolution of 1nA

Input voltage: 24 V DC / 100-240V AC rack version

Operating temperature range: 10°C- 40°C

Unipolar Electrostatic Chuck Power Supply:

Output voltage range: 0 to ±3 kV (3kV)

Output voltage accuracy: <1 %

Output current: <1 mA

Output current accuracy: <1% with a resolution of 1pA

Input voltage: 24 V DC / 100-240V AC rack version

Operating temperature range: 10°C- 40°C

Vacuum-Suited Battery-Powered

Electrostatic Chuck Power Supply:

Output voltage range: 0 to ± 2 (4kV) or ± 2.7 kV (5.4kV)

Output voltage accuracy: <1 %

Output current: <1 mA

Output current accuracy: <1% with a resolution of 1nA

Operating temperature range: 10°C- 85°C

Grinding

Handling

Probing