Handling

Spin Etching

Probing

(Single Wafer) Spin Etching

Handling

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

Slide-Off De-Bonding

Handling

Electro Plating

Annealing

DIE Handling

Available in three basic sizes:

4”/6”, 6”/8”, and 8”/12”,

Weight:

20 kg

Process Media:

Power supply
N2 (CDA/compressed air),
Vacuum

Machine Dimensions:

L x W x H:
621 x 430 x 330 mm

Weight:

1000 kg

Process Media:

Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum

Communication:

SEMI Standard SECS/GEM
other on request

Machine Dimensions:

L x W x H: 1440 x 1485 x 2092 mm

Weight:

1000 kg

Clean Room Class: 100, 10

Electro Plating

Handling

Ion Implantation

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Optical Bonding

Handling

Substrate Bending

Handling

PVD/Sputter

CVD

Plasma Cleaning / Ashing

Optional Media:

N2 or CDA, Vacuum

Process Media:

Power supply 9V battery

Sizes:

4”, 6”, 8”, 12”, other shapes on request

Stationary power supply - Adjustable voltage range:

± 2 kV, ± 3 kV, 0 to 3 kV
others on request

Battery powered - Adjustable voltage range:

± 2 kV, others on request

Grinding

Handling

Probing