News • ProTec Carrier Systems GmbH

Adapter T-ESC - Stimulate your turnover by increasing…

Enable processing multiple wafer sizes on your existing fab equipment, e.g. on…

MCU 3000 - The Next Generation

Increase your scope and raise your yield with the third generation of the manual temporary bonding and debonding machine, the MCU 3000. Small scale temporary bonding has never been so fast, reliable and convenient.

New contact system for mobile T-ESC

The Transfer ElectroStatic Carrier (T-ESC) Technology is already known as a fast and reliable temporary bonding technique for handling and processing of thin and ultra-thin wafers. Clamping forces can be achieved within…

ProTec offers the solution for mass production of MicroLEDs

Actually, the huge benefits of MicroLEDs cannot be used due to the missing mass production readiness of the transfer process. Currently, one of the established methods is to transfer the MicroLED from its donor wafer to…

Transfer ElectroStatic Carrier Technology (T-ESC)

No more wafer breakage during wafer testing with Wafer…

During wafer test processes strong bowed wafers are at a major risk of breakage.…