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MCU 3000 - The Next Generation

Increase your scope and raise your yield with the third generation of the manual temporary bonding and debonding machine, the MCU 3000. Small scale temporary bonding has never been so fast, reliable and convenient.

The new release of our manual electrostatic temporary bonding station prioritizes enhanced user-friendliness and increased efficiency, saving the operator's time.

What is new:

> Optimized software and hardware featuring:

   > Serial electrostatic chucking

   > Graphical live output of the chucking data

   > Faster and simpler exchange between the mobile electrostatic Carriers (T-ESC®s)

> Greatly reduced working time of the operator and a better transparency of the temporary bonding process

> Upgraded housing

 

Third generation of the MCU 3000