T-ESC®

Transferable Electrostatic Carriers

The Transferable Electrostatic Carrier (T-ESC®) is an adhesive-free temporary bonding method that enables the safe and reliable processing of fragile substrates and various materials such as ultra-thin substrates, GaAs, InP, LN, LT, thin silicon, thin MEMS wafers and many more. The basic concept behind this sustainable temporary bonding technology involves the use of electrostatic forces to chuck device wafers onto mobile rigid Carriers (T-ESC®).

These wafer-carrier packages can then be handled and securely processed like wafers of standard thickness through existing machines within the customer facility. Therefore, existing cassettes, handling tools and fabrication equipment can be used without modifications. Additionally, the warping and bowing of thin and ultra-thin substrates are eliminated. The Transferable Electrostatic Carriers are available in the standard sizes from 2" to 12" and in customized shapes adapted to the intended application.

The Adapter Carrier

Each T-ESC® type is offered as an adapter version that allow machines to process device wafers of different diameters and forms. The smaller device wafer can be temporarily bonded to an Adapter Carrier and is held in position by electrostatic forces. For example, a 4”/8” Adapter T-ESC is suited to fixate a 4” wafer on an 8” Adapter T-ESC.

The package of a 4” wafer and an 8” Adapter Carrier can now be used in the intended equipment, e.g. an 8” Stepper. The Stepper tool recognizes a standard 8” substrate and can now process the smaller 4” wafer sizes.

Grinding

Handling

Probing

Handling

Electro Plating

Annealing

DIE Handling

(Single Wafer) Spin Etching

Handling

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

Slide-Off De-Bonding

Handling

Spin Etching

Probing

Electro Plating

Handling

Ion Implantation

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Our Machines

ACU 3000

A fully automated electrostatic chucking/dechucking unit with up to 120 wafers and/or T-ESC® packages per hour, guaranteeing the highest yield during handling and many diagnostics features.

Learn More

MCU 3000

A manual chucking / dechucking unit of thin and ultra-thin substrates on carriers (T-ESC®s) for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostics features.

Learn More