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Semiconductors, Machines, Carriers and your Special Solution

The ESC and T-ESC® technologies by ProTec® offer the solution for demanding processing on new or already existing equipment. They lead to a better cost of ownership and ensure the easy integration of new processes on already existing lines, such as thin glass.

coating on standard equipment, temporary bonding without adhesives, gripping and fixation of sensitive substrates. Highest yield even for fragile substrates can be generated for inline- as well as cluster-based processing tools.

Electrostatic chucks securely fixate fragile substrates during manufacturing processes with the help of electrostatic forces

Electrostatic Chuck (ESC)

The ESC technology by ProTec® offers the solution for demanding processing on new or even existing equipment.

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Transferable Electrostatic Carriers allow to safely handle and process fragile substrates by temporarily bonding them onto our T-ESC®s

Transferable Electrostatic Carrier (T-ESC®)

The T-ESC® technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates.

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Here are some ideas on how to use our electrostatic technology in different ways. Our electrostatic technology is perfectly suited for the fixation of every kind of brittle, thin, flexible or structured materials where other fixation technologies such as vacuum and magnetic force may not be applicable.

Special Solutions

Find special solutions for your product based on our touchless gripping by electrostatic energy fields.

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The ACU 3000 automatically (de)bonds up to 120 wafers and carriers per hour in high volume. These wafer-carrier packages can then be safely handled in manufacturing processes.

ACU 3000

ProTec®'s automated chucking unit (ACU 3000) is built for high volume temporary bonding and debonding applications with up to 120 wafer + T-ESC® packages per hour.

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The Manual Chucking Unit is used to manually (de)bond device wafers with electrostatic carriers in low volume and R&D production areas.

MCU 3000

The manual chucking unit (MCU 3000) is used to temporarily bond and debond the device wafer with our T-ESC®s. It is suited for low volume or in R&D production areas.

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ProTec®’s Electrostatic Chuck Power Supplies enable to control the voltage and output current to power electrostatic chucks.

Electrostatic Chuck Power Supplies

ProTec®'s electrostatic chuck power supplies make it possible to accurately control the fixation of substrates on e-chucks during the manufacturing process.

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The Racket Bipolar holds ultra-thin wafers and other substrates and allows to transfer and align them easily.

Racket Bipolar

The ProTec®(TOR) racket bipolar is an easy-to-use tool for transferring fragile substrates such as ultra-thin wafers, glass or conductive and non-conductive foils.

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FAQ

If you have any questions about our technology, you can find the most popular answers here. Otherwise please feel free to contact us.

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News

In our news-list you can find the highlights of our company. E.g. "ProTec offers the solution for mass production of MicroLED's"!

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