Semiconductors, Machines, Carrier and your special solution

The ESC and T-ESC® Technologies by ProTec® offer the solution for demanding processing on new or even existing equipment. They lead to a better cost of ownership and ensure an easy integration of new processes on already existing lines, such as thin glass coating.

on standard equipment, temporary bonding without adhesive, gripping and fixation of sensitive substrates. Highest yield even for fragile substrates can be generated for inline as well as cluster based processing tools.

Display/Glass

The ESC and T-ESC® Technologies by ProTec® offer the solution for demanding processing on new or even existing equipment.

Learn More

Semiconductor

The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates.

Learn More

Special solutions

Special solutions for your product based on our touchless gripping by electrostatic energy field.

Learn More

ACU 3000

ProTec®´s Automated Chucking Unit (ACU 3000) is built for high volume temporary bond and de-bond applications with up to 120 wafer + T-ESC® packages per hour.

Learn More

MCU 3000

The Manual Chucking Unit (MCU 3000) is used to temporarily bond and de-bond the device wafer with our T-ESCs®. It is suited for low volume or R&D production.

Learn More

Electrostatic Chuck Power Supply

ProTec's Electrostatic Chuck Power Supplies make it possible to accurately control the fixation within the manufacturing process.

Learn More

Racket bipolar

The ProTec®(TOR) Racket bipolar is an easy to use tool for transferring fragile substrates such as ultra thin wafers, glass or conductive and non-conductive foils.

Learn More