protec carrier systems
Products
Semiconductors, Machines, Carriers and your Special Solution
coating on standard equipment, temporary bonding without adhesives, gripping and fixation of sensitive substrates. Highest yield even for fragile substrates can be generated for inline- as well as cluster-based processing tools.
Electrostatic Chucks (ESCs)
The ESC and T-ESC® technologies by ProTec® offer the solution for demanding processing on new or even existing equipment.
Learn MoreTransferable Electrostatic Carriers (T-ESC®s)
The T-ESC® technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates.
Learn MoreSpecial Solutions
Find special solutions for your product based on our touchless gripping by electrostatic energy fields.
Learn MoreACU 3000
ProTec®'s automated chucking unit (ACU 3000) is built for high volume temporary bonding and debonding applications with up to 120 wafer + T-ESC® packages per hour.
Learn MoreMCU 3000
The manual chucking unit (MCU 3000) is used to temporarily bond and debond the device wafer with our T-ESC®s. It is suited for low volume or in R&D production areas.
Learn MoreElectrostatic Chuck Power Supplies
ProTec®'s electrostatic chuck power supplies make it possible to accurately control the fixation of substrates on e-chucks during the manufacturing process.
Learn MoreRacket Bipolar
The ProTec®(TOR) racket bipolar is an easy-to-use tool for transferring fragile substrates such as ultra-thin wafers, glass or conductive and non-conductive foils.
Learn MoreFAQ
If you have any questions about our technology, you can find the most popular answers here. Otherwise please feel free to contact us.
Learn MoreNews
In our news-list you can find the highlights of our company. E.g. "ProTec offers the solution for mass production of MicroLED's"!
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