protec carrier systems
Products
Semiconductors, Machines, Carrier and your special solution
The ESC and T-ESC® Technologies by ProTec® offer the solution for demanding processing on new or even existing equipment. They lead to a better cost of ownership and ensure easy integration of new processes on already existing lines, such as thin glass coating
on standard equipment, temporary bonding without adhesive, gripping and fixation of sensitive substrates. Highest yield even for fragile substrates can be generated for inline as well as cluster based processing tools.
Display/Glass
The ESC and T-ESC® Technologies by ProTec® offer the solution for demanding processing on new or even existing equipment.
Learn MoreSemiconductor
The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates.
Learn MoreSpecial solutions
Special solutions for your product based on our touchless gripping by electrostatic energy field.
Learn MoreACU 3000
ProTec®´s Automated Chucking Unit (ACU 3000) is built for high volume temporary bond and de-bond applications with up to 120 wafer + T-ESC® packages per hour.
Learn MoreMCU 3000
The Manual Chucking Unit (MCU 3000) is used to temporary bond and de-bond the device wafer with our T-ESCs®. It is suited for low volume or R&D production.
Learn MoreMeasurement Controller
ProTec® offers a wide range of High Voltage power supplies. This is our High Voltage Measurement Controller (HV MC) for dedicated chucking tasks.
Learn MoreRacket bipolar
The ProTec®(TOR) Racket bipolar is an easy to use tool for transferring fragile substrates such as ultra thin wafers, glass or conductive and non-conductive foils.
Learn MoreFAQ
If you have any questions to our technology, here you find the most popular answers. Otherwise please feel free to contact us!
Learn MoreNews
In our news-list you find the highlights of our company. E.g. "ProTec offers the solution for mass production of MicroLED's"!
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