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How does electrostatic fixation work? Is there any influence of the substrate material on the chucking behavior? Besides an electrostatic chuck or mobile carrier, what do I need to use it? Can I use an electrostatic chuck in a vacuum environment? What are the differences between electrostatic fixtures compared to vacuum fixtures? What are the differences between the different temporary bonding methods: glue, TAIKO, mobile electrostatic carrier in semiconductor applications? Is it possible to hold multiple samples on one chuck/carrier? Can I recharge the mobile electrostatic carrier (T-ESC®)? Is it possible to customize the electrostatic chucking solutions from ProTec?

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