protec carrier systems
machinery
(MEMBER OF THE T-ESC® FAMILY)
Polymer T-ESC®
The Polymer Transfer ElectroStatic Carrier (Polymer T-ESC®) is a low cost carrier solution for processes without high heat impact where only handling is in focus. Additionally, it can be used for wafer flipping applications.
As an option there is a modified version of this mobile electrostatic carrier which is suited for spin etching in SEZ-Tools with Bernoulli Chucks. The special shape of the Polymer T-ESC® enables carrying a thin substrate through the process without creating residuals between the carrier and the thin wafer during the etching process.
Polymer T-ESC®
Typical Applications
- Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors etc.)
- High flatness
- Re-usable
- Sizes from 2" to 12", customized shapes and features possible
Recommended Processes
- Handling
- Probing
- Spin Etching
Handling
During the wafer processing the wafer needs to be transferred back and forth from the cassettes to the tools and also inside the tools from one station to the other. For fragile substrates this is already challenging, because they tend to break or get cracks, which can lead to future breakage. Also the bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling. Therefore, the wafer breakage is eliminated.
Spin Etching
Spin etching is following the same principle as spin coating. The substrate is clamped to a chuck and during the spinning, etching chemicals are jetted to the surface.
Probing
Various probing methods exist. They are used to check the substrate´s or device´s functionality, e.g. there are optical inspection or electrical probing.