Protec
Display / Glass
Handling
Spin Etching
Probing
(Single Wafer) Spin Etching
Handling
Lithography
Spin Coating
Baking
Exposure
Resist Developing
Resist Stripping
Slide-Off De-Bonding
Handling
Electro Plating
Annealing
DIE Handling
Weight:
1000 kg
Process Media:
Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum
Communication:
SEMI Standard SECS/GEM
other on request
Machine Dimensions:
L x W x H: 1440 x 1485 x 2092 mm
Weight:
1000 kg
Clean Room Class: 100, 10
Optical Bonding
Handling
Substrate Bending
Optional Media:
N2 or CDA, Vacuum
Process Media:
Power supply 9V battery
Sizes:
4”, 6”, 8”, 12”, other shapes on request
Stationary power supply - Adjustable voltage range:
± 2 kV, ± 3 kV, 0 to 3 kV
others on request
Battery powered - Adjustable voltage range:
± 2 kV, others on request
Grinding
Handling
Probing
<p>Our Machines</p>
ACU 3000
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.
Learn MoreMeasurement Controller
ProTec® offers a wide range of High Voltage power supplies, our High Voltage Measurement Controllers (HV MC) for dedicated chucking tasks.
Learn More