The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates (thinner 50 µm), e.g. GaAs, InP, LN, LT, thin silicon, thin MEMS wafer and many more. The basic concept behind this adhesive free temporary bonding technology involves using electrostatic force to chuck thin and ultra-thin wafers onto mobile rigid Carriers (T-ESC®). Such wafer-Carrier packages can be handled and processed like wafers of standard thickness.
Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Additional effect: the warping and bowing of thin and ultra-thin substrates are eliminated, which is highly welcome. All our Carriers are available in standard sizes from 2" to 12" and additionally in customized shapes suited to the intended application.
(Single Wafer) Spin Etching
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.Learn More
A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.Learn More