The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates (< 50 µm), e.g. GaAs, InP, LN, LT, thin silicon, thin MEMS wafer and many more. The basic concept behind this adhesive free temporary bonding technology involves using electrostatic force to chuck thin and ultra-thin wafers onto mobile rigid Carriers (T-ESC®). Such wafer-Carrier packages can be handled and processed like wafers of standard thickness.
Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Additional effect: the warping and bowing of thin and ultra-thin substrates are eliminated, which is highly welcome. All our Carriers are available in standard sizes from 2" to 12" and additionally in customized shapes suited to the intended application.
(MEMBER OF THE T-ESC® FAMILY)
The Polymer Transfer ElectroStatic Carrier (Polymer T-ESC®) is a low cost Carrier solution for processes without high heat impact where only handling is in focus. Additionally it can be used for wafer flipping applications.
As an option there is a modified version of this mobile electrostatic carrier which is suited for spin etching in SEZ-Tools with Bernoulli Chucks. The special shape of the Polymer T-ESC® enables carrying a thin substrate through the process without creating residuals between carrier and thin wafer during the etching process.
- Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors, etc.)
- High flatness
- Sizes from 2" to 12", customized shapes and features possible
- Spin Etching
During Wafer processing the wafer needs to be transferred back and forth from cassettes to tools and also inside the tools from on station to the other. For fragile substrates this is already challenging, because they tend do brake or get cracks, which can lead to future breakage. Also bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling, therefore wafer breakage is eliminated.
Spin Etching is following the same principle like spin coating. The substrate is clamped to a chuck and during spinning etching chemicals are jetted to the surface.
Various probing methods exist, they are used to check the substrate´s or device´s functionality, e.g. there are optical inspection or electrical probing.
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.Learn More
A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.Learn More