welcome to protec
The Gripper for touchless gripping by electrostatic
energy field
Listview for the terms
- 3D IC
- Three-dimensional integrated circuit
- ACU
- Automated Chucking Unit
- CDA
- Clean Dry Air
- CVD
- Chemical Vapor Deposition
- DRIE
- Deep Reactive Ion Etching
- EBR
- Edge Bead Removal
- ESC
- Electrostatic Chuck
- GaAs
- Gallium Arsenide
- HT
- High Temperature
- HV MC
- High Voltage Measurement Controller
- InP
- Indium Phosphide
- LN
- Lithium Niobate
- LT
- Lithium Tantalate
- MCU
- Manual Chucking Unit
- MEMS
- Microelectromechanical systems
- N2
- Nitrogen
- OLED
- Organic Light Emitting Diode
- OVPD
- Organic Vapor Phase Deposition
- PCS
- ProTec Carrier Systems
- PECVD
- Plasma Enhanced Chemical Vapor Deposition
- PR
- Plasma Resistant
- PVD
- Physical Vapor Deposition
- RIE
- Reactive Ion Etching
- SiC
- Silicon Carbide
- T-ESC
- Transferable ElectroStatic Carrier