Optical Bonding is used for different reasons in the display manufacturing process. It can help to make the fragile glass more robust while still maintaining a good picture quality, or enhancing the readability outdoor. Basically the process describes a method to bond an optical active (e.g. transparent) substrate with another one by glue. In combination with our T-ESC® technology the process can be carried out in vacuum to enhance the results.

During wafer processing the wafer needs to be transferred back and forth from the cassettes to the tools and also inside the tools from one station to the other. For fragile substrates this is already challenging, because they tend to break or get cracks, which can lead to future breakage. Also the bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling. Therefore, the wafer breakage is eliminated.

During various processes a substrate needs to be shaped according to the customers' needs. In some cases it needs to be flat, in others it should follow a given shape and stay fixed over the process time.