The ESC and T-ESC® Technologies by ProTec® offer the solution for demanding processing on new or even existing equipment, leading to a better cost of ownership and an easy integration of new processes on already existing lines, such as thin glass coating on standard equipment. Highest yield also for fragile substrates can be generated for inline and also cluster based processing tools.

Our electrostatic systems are specially designed for the needs of our customers, e.g. chucking multiple glasses (also 3D type) on a mobile electrostatic Carrier and guiding them thru an inline plasma coating step, or for temperature controlled OLED evaporation.


Polymer electrostatic chuck and Polymer T-ESC®

ProTec®´s Polymer electrostatic chucking solutions are used in low temperature vacuum and atmospheric processes for chucking glass or foil. The design is customized to your specific needs, here also 3D shapes are possible which allow the substrate to be chucked in the desired configuration. The chucking procedure can be done either at atmosphere or inside vacuum and the transfer between both is always possible, so that e.g. optical bonding application with thin glasses or foils can also be done in vacuum environment. Depending on application the Polymer electrostatic chuck and Polymer T-ESC® can be used in Inline or Cluster based application. The chuck is powered by a stationary or mobile High Voltage Measurement Controller from ProTec®.

Polymer electrostatic chuck and Polymer T-ESC®

Typical Applications

  • 100% customized in size, shape, functionality to best customer benefit

  • Size starting from very small 10x10mm² to large formats like Gen 10.5

Recommended Processes

  • Handling

  • Optical Bonding

  • Substrate Bending



Optical Bonding

Optical Bonding is used for different reasons in the display manufacturing process. It can help to make the fragile glass more robust while still having a good picture quality, or enhancing the readability outdoor. Basically the process describes a method to bond an optical active (e.g. transparent) substrate with another one by glue. In combination with our T-ESC® technology the process can be carried out in vacuum to enhance the results.


During Wafer processing the wafer needs to be transferred back and forth from cassettes to tools and also inside the tools from on station to the other. For fragile substrates this is already challenging, because they tend do brake or get cracks, which can lead to future breakage. Also bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling, therefore wafer breakage is eliminated.

Substrate Bending

During various processes a substrate needs to be shaped according to the customer needs, in some cases it needs to be flat, in others it should follow a given shape and stay fixed over the process time.

Our Machines

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

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MCU 3000 freigestellt

MCU 3000

A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.

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